Performance Evaluation and parametric optimization of a Heat Sink for Cooling of Electronic Devices with Entropy Generation Minimization

Hardik Patel 1 * , V. K. Matawala 2

EUROPEAN J SUSTAINAB DEV, Volume 3, Issue 4, Article No: em0100.

https://doi.org/10.29333/ejosdr/5896

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Abstract

Thermal management is essential for electronics products. Experimental and CFD analysis of a heat sink for thermal management are represented. After analysis, compared with the experimental and computation analysis. Also, Entropy generation model, fluid flow model and heat transfer model are described. Total entropy generation calculated Sgen and entropy generation minimization are done for best utilization of heat sink for cost, size and better power management. Optimized heat sink by two method one Parametric Optimization and other Multi-variable optimization for minimizing entropy generation. From the results behaviour of mass flow rates with temperature, velocity, pressure drops and other parameters are analysed. The maximum temperature is located at heated base surface of heat sink, below the channel outlet, due to the low velocity of the fluid flow and resulting high concentration of heat flux. The combined conduction–convection heat transfer in the heat sink produces very complex three-dimensional heat flow pattern with large, longitudinal, upstream directed heat recirculation zones in the highly conducting aluminium materials, where the fluid and solid are in direct contact. A detailed description of the average heat transfer coefficient, temperature, heat flux and Nusselt number was obtained. The goal of this research is to find the cooling of heat sink at minimum entropy generation for saving energy and sustainable development.

Keywords

heat sink, thermal performance, CFD, EGM, electronic cooling

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Citation

Patel, H., and Matawala, V. K. (2019). Performance Evaluation and parametric optimization of a Heat Sink for Cooling of Electronic Devices with Entropy Generation Minimization. European Journal of Sustainable Development Research, 3(4), em0100. https://doi.org/10.29333/ejosdr/5896

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